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0.1-0.5mm Copper Thickness Si3N4 Silicon Nitride AMB Substrate for High Power Device Packaging


  • Place of Origin : Fujian, China
  • Type : Ceramic Parts
  • Application : Industrial Ceramic, AMB Substrate
  • Material : Aluminum Nitrid, 96% Alumina/ AlN / Si3N4
  • Brand Name : INNOVACERA
  • Processing Service : Moulding
  • Coating Layer : Mo/Mn
  • Coating Thickness : 8-30μm
  • Plated Layer : Nickel/Copper/Gold
  • Plating Thickness : 2-9μm
  • Max. Use Temperature : 1600℃
  • Density : 3.7g/cm3
  • Thermal Conductivity : 25W/(m.k)
  • Compressive Strength : 2300Mpa
$12.99

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  • Place of Origin : Fujian, China
  • Type : Ceramic Parts
  • Application : Industrial Ceramic, AMB Substrate
  • Material : Aluminum Nitrid, 96% Alumina/ AlN / Si3N4
  • Brand Name : INNOVACERA
  • Processing Service : Moulding
  • Coating Layer : Mo/Mn
  • Coating Thickness : 8-30μm
  • Plated Layer : Nickel/Copper/Gold
  • Plating Thickness : 2-9μm
  • Max. Use Temperature : 1600℃
  • Density : 3.7g/cm3
  • Thermal Conductivity : 25W/(m.k)
  • Compressive Strength : 2300Mpa

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