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  • Model Number : Custom PCB & PCB Assembly
  • Place of Origin : Guangdong, China
  • Brand Name : FS
  • Base Material : FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
  • Copper Thickness : 0.4-2mil(10-50um)
  • Board Thickness : 0.2-6mm
  • Min. Hole Size : 0.1mm(4mil)for HDI / 0.15mm(6mil)
  • Min. Line Width : 0.075mm/0.075mm(3mil/3mil)
  • Min. Line Spacing : 0.003''
  • Surface Finishing : HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
  • Board Size : custom
  • Layer No. : 1-32 Layers
  • PCB Test : Flying probe and AOI (Default)/Fixture Test
  • Base, Cover film, Stiffeners thickness: : 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
  • BGA Ball Pitch : 1mm ~ 3mm(4mil ~ 12mil)
  • PCB Assembly Method : SMT, Through-hole, Mixed, BGA
  • PCB Assembly Test : Visual Inspection (default), AOI, FCT, X-RAY
  • Hi-TG FR4 Material : Tg-130 Tg-140 Tg-160 Tg-170
  • Electrical Testing : Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
  • Certificate Standard : IPC-A-600H Class 2, Class 3, TS16949,,ROHS and as your need
  • Special requirements : Buried and blind vias, Impedance control, via plug, BGA soldering etc.
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  • Model Number : Custom PCB & PCB Assembly
  • Place of Origin : Guangdong, China
  • Brand Name : FS
  • Base Material : FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
  • Copper Thickness : 0.4-2mil(10-50um)
  • Board Thickness : 0.2-6mm
  • Min. Hole Size : 0.1mm(4mil)for HDI / 0.15mm(6mil)
  • Min. Line Width : 0.075mm/0.075mm(3mil/3mil)
  • Min. Line Spacing : 0.003''
  • Surface Finishing : HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
  • Board Size : custom
  • Layer No. : 1-32 Layers
  • PCB Test : Flying probe and AOI (Default)/Fixture Test
  • Base, Cover film, Stiffeners thickness: : 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
  • BGA Ball Pitch : 1mm ~ 3mm(4mil ~ 12mil)
  • PCB Assembly Method : SMT, Through-hole, Mixed, BGA
  • PCB Assembly Test : Visual Inspection (default), AOI, FCT, X-RAY
  • Hi-TG FR4 Material : Tg-130 Tg-140 Tg-160 Tg-170
  • Electrical Testing : Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
  • Certificate Standard : IPC-A-600H Class 2, Class 3, TS16949,,ROHS and as your need
  • Special requirements : Buried and blind vias, Impedance control, via plug, BGA soldering etc.

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